Modular heat-dissipating device

ABSTRACT

A modular heat-dissipating device includes an electronic device, a cold plate and a heat-dissipating base. The electronic device includes a casing, a covering plate and a circuit board. The circuit board is disposed within the casing. Plural electronic components are disposed on the circuit board. The cold plate, the casing and the covering plate are combined together to define a sealed space. The cold plate includes plural first fixing structures. The heat-dissipating base is selected from an air-cooling member or a liquid-cooling member. Each of the air-cooling member and the liquid-cooling member includes a first slab under the cold plate and plural second fixing structures corresponding to the first fixing structures. The air-cooling member and the liquid-cooling member are normalized. The heat generated by the electronic device is transmitted to the first slab through the cold plate, and then dissipated away by the air-cooling member or the liquid-cooling member.

FIELD OF THE INVENTION

The present invention relates to a modular heat-dissipating device, andmore particularly to a modular heat-dissipating device for use in apower supply of an electric vehicle or a hybrid electric vehicle.

BACKGROUND OF THE INVENTION

Fossil fuels such as petroleum and coal are widely used in automobilesor power plants for generating motive force or electrical power. Asknown, burning fossil fuels produces waste gases and carbon oxide. Thewaste gases may pollute the air. In addition, carbon dioxide isconsidered to be a major cause of the enhanced greenhouse effect. It isestimated that the world's oils supply would be depleted in the nextseveral decades. The oil depletion may lead to global economic crisis.

Consequently, there are growing demands on clean and renewable energy.Recently, electric vehicles and hybrid electric vehicles have beenresearched and developed. Electric vehicles and hybrid electric vehiclesuse an electrical generator to generate electricity. In comparison withthe conventional gasoline vehicles and diesel vehicles, the electricvehicles and hybrid electric vehicles are advantageous because of lowpollution, low noise and better energy utilization. The uses of theelectric vehicles and hybrid electric vehicles can reduce carbon dioxideemission in order to decelerate the greenhouse effect.

As known, a power supply (e.g. an AC-to-DC charger or a DC-to-DCconverter) is an essential component of the electric vehicle and thehybrid electric vehicle. For meeting the safety regulations, the powersupply is usually designed as a sealed device to achieve a waterproofand dustproof purpose. It is critical to dissipate the heat generated bythe electronic components of the sealed power supply.

The power supply of the electric vehicle or the hybrid electric vehicleis usually installed on the front side or rear side of the vehicle body.The heat-dissipating system used in the sealed power supply is selectedaccording to the installing location, the heat transfer direction andthe heat generation rate of the power supply. The sealed power supplyusually has an air-cooling heat-dissipating system, a liquid-coolingheat-dissipating system, or both. In the air-cooling heat-dissipatingsystem, plural fins are formed on a surface of the power supply. Theheat generated by the power supply is transmitted to the fins, andradiated to the air according to a natural convection mechanism orremoved away by a forced convection mechanism with a fan. In theliquid-cooling heat-dissipating system, a cooling liquid is pumped to aseal groove to remove away the heat generated by the heat source.

However, both of the air-cooling heat-dissipating system and theliquid-cooling heat-dissipating system have the disadvantages of havinglarge volume and occupying large installing space and are inflexible tobe allocated into the power supplies according to the properties of thepower supplies. For example, it is not easy to dispose the air-coolingheat-dissipating system or the liquid-cooling heat-dissipating systeminto a narrow installing space of the power supply. Since the installinglocation, the heat transfer direction and the heat generation rate ofthe power supply is diversified, the heat-dissipating system needs to beinclusively designed. That is, the air-cooling heat-dissipating systemor the liquid-cooling heat-dissipating system is previously determinedin order to dissipate the heat of the power supply. The heat-dissipatingsystem used in the sealed power supply of the electric vehicle or thehybrid electric vehicle, however, still has some drawbacks. For example,if the installing space is changed, the heat-dissipating efficacy isinsufficient or the power supply is modified, the heat-dissipatingsystem should be re-designed and reproduced. In other words, theconventional heat-dissipating system is not cost-effective.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a modularheat-dissipating device for use in a power supply of an electric vehicleor a hybrid electric vehicle, in which a normalized air-cooling memberor a normalized liquid-cooling member is selected according to thepractical requirements.

In accordance with an aspect of the present invention, there is provideda modular heat-dissipating device for use in an electric vehicle or ahybrid electric vehicle. The modular heat-dissipating device includes anelectronic device, a cold plate and a heat-dissipating base. Theelectronic device includes a casing, a covering plate and a circuitboard. The covering plate is disposed over the casing for shielding thecasing. The circuit board is disposed within the casing. Pluralelectronic components are disposed on the circuit board. The cold plate,the casing and the covering plate are combined together to define asealed space. The cold plate is disposed under the electronic device andincludes plural first fixing structures. The heat-dissipating base isselected from an air-cooling member or a liquid-cooling member. Each ofthe air-cooling member and the liquid-cooling member includes a firstslab under the cold plate and plural second fixing structurescorresponding to the first fixing structures. The air-cooling member andthe liquid-cooling member are normalized. The heat generated by theelectronic device is transmitted to the first slab through the coldplate, and then dissipated away by the air-cooling member or theliquid-cooling member.

In an embodiment, the electronic components are disposed on a firstsurface of the circuit board, and the cold plate is securely attached ona second surface of the circuit board. The second surface is opposed tothe first surface.

In an embodiment, the cold plate and the casing are integrally formed.

In an embodiment, a thermally-conductive medium is applied between thecold plate and the first slab for facilitating heat transfer between thecold plate and the first slab.

In an embodiment, the first fixing structures of the cold plate arealigned with the second fixing structures of the first slab, and thecold plate and the first slab are combined together via engagementbetween the first fixing structures and the second fixing structures.

In an embodiment, the first slab has the same area as the cold plate.

In an embodiment, the cold plate and first slab are made of a materialwith relatively high thermal conductivity.

In an embodiment, the air-cooling member further includes plural fins,which are disposed under the first slab.

In an embodiment, the air-cooling member further includes plural finsand a fan, which are disposed under the first slab.

In an embodiment, the liquid-cooling member further includes a box, andthe first slab and the box are combined together to seal the box. Thebox includes a liquid inlet, a liquid outlet and a crooked groove incommunication with the liquid inlet and the liquid outlet. A coolingliquid is introduced into the crooked groove through the liquid inlet toremove heat so that a heated liquid is exited from the liquid outlet.

In an embodiment, the first fixing structures of the cold plate and thesecond fixing structures of the first slab are engaged with each otherby fastening elements so that the heat-dissipating base and the coldplate are combined together.

In an embodiment, plural third fixing structures are formed on thecasing corresponding to the first fixing structures and the secondfixing structures. The first fixing structures, the second fixingstructures and the third fixing structures are engaged with each otherby fastening elements so that the electronic device and theheat-dissipating base are combined together.

The above contents of the present invention will become more readilyapparent to those ordinarily skilled in the art after reviewing thefollowing detailed description and accompanying drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic exploded view illustrating a modularheat-dissipating device according to a first embodiment of the presentinvention;

FIG. 2A is a schematic exploded view illustrating a modularheat-dissipating device of FIG. 1, in which the air-cooling member isselected as the heat-dissipating base;

FIG. 2B is a schematic assembled view illustrating the modularheat-dissipating device of FIG. 2A;

FIG. 3A is a schematic exploded view illustrating a modularheat-dissipating device of FIG. 1, in which the liquid-cooling member isselected as the heat-dissipating base; and

FIG. 3B is a schematic assembled view illustrating the modularheat-dissipating device of FIG. 3A.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The present invention will now be described more specifically withreference to the following embodiments. It is to be noted that thefollowing descriptions of preferred embodiments of this invention arepresented herein for purpose of illustration and description only. It isnot intended to be exhaustive or to be limited to the precise formdisclosed.

FIG. 1 is a schematic exploded view illustrating a modularheat-dissipating device according to a first embodiment of the presentinvention. As shown in FIG. 1, the modular heat-dissipating device 1 isapplied to an electric vehicle and a hybrid electric vehicle. Themodular heat-dissipating device 1 includes an electronic device 10, acold plate 14 and a heat-dissipating base. The electronic device 10includes a covering plate 11, a casing 12 and a circuit board 13. Anexample of the electronic device 10 is a power supply such as anAC-to-DC charger or a DC-to-DC converter. The circuit board 13 isdisposed within the casing 12. The covering plate 11 is disposed overthe casing 12 for shielding the casing 12. The cold plate 14, thecircuit board 13, the casing 12 and the covering plate 11 are combinedtogether to define a sealed space. Plural electronic components 131 aredisposed on a first surface 130 of the circuit board 13. In thisembodiment, the cold plate 14 is a flat plate. The cold plate 14 issecurely attached on a second surface 132 of the circuit board 13. Inaddition, plural first fixing structures 141 are formed on the coldplate 14. In some embodiment, the cold plate 14 and the casing 12 can beintegrally formed.

The heat-dissipating base is selected from an air-cooling member 15 or aliquid-cooling member 16. The air-cooling member 15 includes a firstslab 151. The first slab 151 is disposed under the cold plate 14.Corresponding to the first fixing structures 141, plural second fixingstructures 153 are formed on the first slab 151. The liquid-coolingmember 16 includes a first slab 161. The first slab 161 is disposedunder the cold plate 14. Corresponding to the first fixing structures141, plural second fixing structures 162 are formed on the first slab161. The air-cooling member 15 and the liquid-cooling member 16 arenormalized. According to the practical requirements, one of theair-cooling member 15 and the liquid-cooling member 16 is selectivelyattached on the backside of the cold plate 14. As such, the heatgenerated by the electronic device 10 is transmitted from the secondsurface 132 of the electronic device 10 to the first slab 151 (or 161)through the cold plate 14, and then the heat is transferred by theair-cooling member 15 or the liquid-cooling member 16.

FIG. 2A is a schematic exploded view illustrating a modularheat-dissipating device of FIG. 1, in which the air-cooling member isselected as the heat-dissipating base. As shown in FIG. 2A, from top tobottom, the modular heat-dissipating device 1 sequentially includes thecovering plate 11, the casing 12, the circuit board 13, the cold plate14 and the air-cooling member 15. In this embodiment, the top and bottomsides of the casing 12 are hollowed. The casing 12 is made of a metallicmaterial with high thermal conductivity. The circuit board 13 iscompletely sheltered by the casing 12. The cold plate 14, the casing 12and the covering plate 11 are combined together to define a sealedspace. As such, the electronic device 10 is waterproof and dustproof.Plural electronic components 131 are disposed on the first surface 130of the circuit board 13. The circuit board 13 further has a secondsurface 132 opposed to the first surface 130. Optionally, athermally-conductive medium (not shown) is applied between theelectronic components 131 and the circuit board 13, so that the heatgenerated by the electronic components 131 could be transmitted from thefirst surface 130 to the second surface 132 of the circuit board 13. Insome embodiment, a thermally-conductive medium (not shown) is appliedbetween the second surface 132 of the circuit board 13 and the coldplate 14, so that the heat could be transmitted from the second surface132 of the circuit board 13 to the cold plate 14. An example of thethermally-conductive medium includes but is not limited to athermally-conductive adhesive.

The cold plate 14 is disposed under the electronic device 10. The coldplate 14 is made of a material with high thermal conductivity (e.g.metallic material). The cold plate 14 is a flat plate. Plural firstfixing structures 141 are formed on the cold plate 14. In someembodiments, the cold plate 14 is integrally formed with the casing 12.The air-cooling member 15 is disposed under the cold plate 14. Theair-cooling member 15 includes the first slab 151 and plural fins 152.Corresponding to the first fixing structures 141, plural second fixingstructures 153 are formed on the first slab 151. The first fixingstructures 141 and the second fixing structures 153 have complementaryprofiles to be engaged with each other. For example, the first fixingstructures 141 and the second fixing structures 153 are protrudingblocks and indentations, respectively. Due to the engagement between thefirst fixing structures 141 and the second fixing structures 153, theair-cooling member 15 and the cold plate 14 are combined together. Insome embodiments, the first fixing structures 141 and the second fixingstructures 153 are fixing holes. By penetrating fastening elements 17(e.g. screws, see FIG. 1) through these fixing holes, the air-coolingmember 15 and the cold plate 14 are combined together. The first slab151 and the fins 152 of the air-cooling member 15 are also made of amaterial with high thermal conductivity (e.g. metallic material). Thenumber and dimension of the fins 152 are varied according to thepractical requirements.

In this embodiment, plural third fixing structures 121 (e.g. fixingholes) are formed on the casing 12 of the electronic device 10. Thethird fixing structures 121 are aligned with the first fixing structures141 of the cold plate 14 and the second fixing structures 153 of thefirst slab 151. By penetrating fastening elements 17 through thesefixing holes, the casing 12 of the electronic device 10, the cold plate14 and the air-cooling member 15 are combined together to produce theresulting structure of the modular heat-dissipating device 1 (see FIG.2B). By the modular heat-dissipating device 1, the waterproof anddustproof functions of the electronic device 10 are achieved. Inaddition, the normalized air-cooling member 15 or the normalizedliquid-cooling member 16 is selected to be integrated into the modularheat-dissipating device according to the installing location, the heattransfer direction and the heat generation rate of the electronic device10 so that the structure of the modular heat-dissipating device 1 issimplified. Since the heat-dissipating base does not need to bere-designed and reproduced, the fabricating cost is reduced. Inaddition, since the heat-dissipating base is selected according to theinstalling location, the space utilization is enhanced.

FIG. 3A is a schematic exploded view illustrating a modularheat-dissipating device of FIG. 1, in which the liquid-cooling member isselected as the heat-dissipating base. As shown in FIG. 3A, from top tobottom, the modular heat-dissipating device 1 sequentially includes thecovering plate 11, the casing 12, the circuit board 13, the cold plate14 and the liquid-cooling member 16. The cold plate 14, the casing 12and the covering plate 11 are combined together to define a sealedspace. The process of combining the electronic device 10 with the coldplate 14 is similar to that illustrated in FIG. 2A, and is notredundantly described herein. The liquid-cooling member 16 includes thefirst slab 161 and a box 163. The first slab 161 and the box 163 aremade of a metallic material with high thermal conductivity.Corresponding to the first fixing structures 141, plural second fixingstructures 162 are formed on the first slab 161. In this embodiment, thefirst fixing structures 141 and the second fixing structures 162 arefixing holes. By penetrating fastening elements 17 through these fixingholes, the liquid-cooling member 16 and the cold plate 14 are combinedtogether. As such, the electronic device 10, the cold plate 14 and theliquid-cooling member 16 are combined together to produce the resultingstructure of the modular heat-dissipating device 1 (see FIG. 3B)

Please refer to FIG. 3A again. The first slab 161 and the box 163 arecombined together to produce the sealed liquid-cooling member 16. Insome embodiments, the first slab 161 and the box 163 are integrallyformed. The box 163 includes a liquid inlet 164 and a liquid outlet 165.A crooked groove 166 is disposed within the box 163. The crooked groove166 is in communication with the liquid inlet 164 and the liquid outlet165. A cooling liquid (not shown) is introduced into the crooked groove166 through the liquid inlet 164. The heat transmitted from theelectronic device 10 to the first slab 161 through the cold plate 14 isremoved by the cooling liquid, and a heated liquid is exited from theliquid outlet 165. In other words, the liquid-cooling member 16 mayfacilitate removing the heat from the electronic device 10 and the firstslab 161.

Please refer to FIG. 1 again. The air-cooling member 15 and theliquid-cooling member 16 are normalized. The numbers and locations ofthe second fixing structures 153 and 162 of the air-cooling member 15and the liquid-cooling member 16 correspond to the first fixingstructures 141 of the cold plate 14. Via the engagement between thefirst fixing structures 141 and the second fixing structures 153, theair-cooling member 15 is combined with the cold plate 14. Similarly, viathe engagement between the first fixing structures 141 and the secondfixing structures 162, the liquid-cooling member 16 is combined with thecold plate 14. In some embodiments, the first slab 151 of theair-cooling member 15, the first slab 161 of the liquid-cooling member16 and the cold plate 14 have the same area in order to facilitatealigning the first slab 151 (or 161) with the cold plate 14. In someembodiments, a thermally-conductive medium (not shown) is appliedbetween the cold plate 14 and the first slab 151 (or 161) forfacilitating heat transfer between the cold plate 14 and the first slab151 (or 161). An example of the thermally-conductive medium includes butis not limited to a thermally-conductive adhesive.

In the above embodiments, a normalized heat-dissipating base is selectedto be integrated into the modular heat-dissipating device according tothe installing location, the heat transfer direction and the heatgeneration rate of the electronic device. In a case that the electronicdevice is installed in a seal space of an electric vehicle or a hybridelectric vehicle, the normalized air-cooling member or the normalizedliquid-cooling member is selected according to the practicalrequirement. Since the heat-dissipating base does not need to bere-designed and reproduced, the fabricating cost is reduced. Inaddition, since the heat-dissipating base is selected according to theinstalling location, the space utilization is enhanced.

From the above description, the modular heat-dissipating device of thepresent invention includes a normalized heat-dissipating base (e.g. anormalized air-cooling member or a normalized liquid-cooling member), acold plate and an electronic device. When the heat-dissipating base andthe electronic device are combined together, the heat generated by theelectronic components of the electronic device is transmitted to thefirst slab of the heat-dissipating base through the cold plate and thendissipated away by the heat-dissipating base. The modularheat-dissipating device of the present invention is easily assembled ordisassembled and has simplified configurations. In other words, theprocess of assembling the modular heat-dissipating device is time-savingand cost-effective. Moreover, since the heat-dissipating base isselected according to the installing location, the space utilization isenhanced.

While the invention has been described in terms of what is presentlyconsidered to be the most practical and preferred embodiments, it is tobe understood that the invention needs not be limited to the disclosedembodiment. On the contrary, it is intended to cover variousmodifications and similar arrangements included within the spirit andscope of the appended claims which are to be accorded with the broadestinterpretation so as to encompass all such modifications and similarstructures.

1. A modular heat-dissipating device for use in an electric vehicle or a hybrid electric vehicle, said modular heat-dissipating device comprising: an electronic device comprising: a casing; a covering plate disposed over said casing for shielding said casing; and a circuit board disposed within said casing and comprising plural electronic components; a cold plate disposed under said electronic device and comprising plural first fixing structures, wherein said cold plate, said casing and said covering plate are combined together to define a sealed space; and a heat-dissipating base selected from an air-cooling member or a liquid-cooling member, wherein each of said air-cooling member and said liquid-cooling member comprises a first slab under said cold plate and plural second fixing structures corresponding to said first fixing structures, and said air-cooling member and the liquid-cooling member are normalized, wherein the heat generated by said electronic device is transmitted to said first slab through said cold plate, and then dissipated away by said air-cooling member or said liquid-cooling member.
 2. The modular heat-dissipating device according to claim 1, wherein said electronic components are disposed on a first surface of said circuit board, and said cold plate is securely attached on a second surface of said circuit board, wherein said second surface is opposed to said first surface.
 3. The modular heat-dissipating device according to claim 1, wherein said cold plate and said casing are integrally formed.
 4. The modular heat-dissipating device according to claim 1, wherein a thermally-conductive medium is applied between said cold plate and said first slab for facilitating heat transfer between said cold plate and said first slab.
 5. The modular heat-dissipating device according to claim 1, wherein said first fixing structures of said cold plate are aligned with said second fixing structures of said first slab, and said cold plate and said first slab are combined together via engagement between said first fixing structures and said second fixing structures.
 6. The modular heat-dissipating device according to claim 1, wherein said first slab has the same area as said cold plate.
 7. The modular heat-dissipating device according to claim 1, wherein said cold plate and first slab are made of a material with relatively high thermal conductivity.
 8. The modular heat-dissipating device according to claim 1, wherein said air-cooling member further comprises plural fins, which are disposed under said first slab.
 9. The modular heat-dissipating device according to claim 1, wherein said air-cooling member further comprises plural fins and a fan, which are disposed under said first slab.
 10. The modular heat-dissipating device according to claim 1, wherein said liquid-cooling member further comprises a box, and said first slab and said box are combined together to seal said box, wherein said box includes a liquid inlet, a liquid outlet and a crooked groove in communication with said liquid inlet and said liquid outlet, wherein a cooling liquid is introduced into said crooked groove through said liquid inlet to remove heat so that a heated liquid is exited from said liquid outlet.
 11. The modular heat-dissipating device according to claim 1, wherein said first fixing structures of said cold plate and said second fixing structures of said first slab are engaged with each other by fastening elements so that said heat-dissipating base and said cold plate are combined together.
 12. The modular heat-dissipating device according to claim 1, wherein plural third fixing structures are formed on said casing corresponding to said first fixing structures and said second fixing structures, wherein said first fixing structures, said second fixing structures and said third fixing structures are engaged with each other by fastening elements, so that said electronic device and said heat-dissipating base are combined together. 